Thermic Edge offers Boron Nitride, a material used for high temperature applications with excellent thermal conductivity, high electrical resistance, and low thermal expansion. Depending on the required application, they are used as precision components, coatings, powders, and lubricant additives in several different high-temperature applications and numerous industries: Semiconductor, LED, Photovoltaic, Vacuum Furnaces, Atomising, and Horizontal Casting. PVD, Plasma Systems, Sintering and Powder metallurgy, Lubricant and Aluminium Casting.
Thermic Edge does not just offer Boron Nitride and composites but also Mykroy, Alumina Silicate, Macor Alumina, Silicon Nitride, Zirconia, and Aluminium Nitride.
PBN is a ceramic made by a chemical vapour deposition process which gives this material a very unique character. Intrinsically pure, it’s the ideal choice for furnace, electrical components, microwave and Semiconductor applications.
Industry standard crucibles such as VGF, LEC, Bridgman for Gallium Arsenide crystal production and auxiliary effusion cell hardware. PBN/PG Heaters can also be manufactured to provide extremely uniform temperature profiles for both compound and semiconductor manufacturing. With bulk impurities at less than 100 parts per million and metallic impurities less than 10 parts per million, PBN will not react with acids, alkalis, organic solvents, molten metals and graphite’s.
| Crystalline Phase | N/A |
|---|---|
| Binder Phase / Binder Type | CVD Process |
| Colour | Cream |
| Typical Applications | Demanding applications when the very best purity, temperature is required such as MBE |
| Directionality | A & C Direction |
| Mechanical Properties | |
| Flexural Strength | 27,500 PSI |
| Young Modulus | N/A |
| RT Compression | 3700 A Direction 48,000 C Direction Unites PSI |
| Open Porosity | 0 |
| Density | 1.95-2.19 |
| Hardness-Knoop (kg/mm2) | N/A |
| Thermal Properties | |
| Thermal Conductivity @ 25°C W/mK | 0.25 “A” / 0.004 “C” |
| Coefficient of Thermal Expansion (10-62) | |
| 25°C – 400°C | N/A |
| 400°C – 800°C | 0.001 “A” / 0.013 “C” |
| 800°C – 1200°C | N/A |
| 1200°C – 1600°C | 0.0025 “A” / 0.27 “C” |
| Specific Heat @ 25°C J/gK | 0.2 cal/g* deg C |
| Max Temperature Oxidising / Inert | 1900 |
| Electrical Properties | |
| Dieletric Constant @ 1 Mhz | “C” 3.7 |
| Dissipation Factor @ 1 Mhz | n/a |
| Dielectric Strength Kv/mm | “C” 230 |
| RT Resistivity (ohm cm) | 1 x 1015 |
| Dieletric Constant a@ 1 Mhz | “C” 3.7 |
| Dissipation Factor @ 1 Mhz | n/a |
| Dielectric Strength Kv/mm | “C” 230 |
| RT Resistivity (ohm cm) | 1 x 1015 |
BN can be offered in many forms including Powder, Paint, Paste, Aerosol and in Hot pressed solid form.
Hot pressed boron nitride has a hexagonal structure like that of graphite. Although HPBN is an insulator with outstanding properties in Temperature, Dielectric constant, Thermal shock, Thermal conductivity. It can also be easily machined into intricate shapes with no post firing necessary. Hot pressed boron nitride is a powder which is sintered at 2000 deg C plus. Depending on the process there are several grades that can be selected for your requirement. Whether its extreme high temperature high vacuum using no binder due to thermal extraction to moisture resistance using calcium borate glass as a binder. There is a grade of HPBN for most applications.
By changing the Boron Nitride properties adding zirconia for molten metal applications such as break rings for horizontal casting or Silica for unparallel resistance to thermal shock and resistance to moisture and Aluminium nitride for excellent thermal properties it can enhance the properties of Boron Nitride.
Boron Nitride is used for high temperature applications requiring excellent thermal conductivity, high electrical resistance and low thermal expansion. Depending on the required application, it can be used as precision components, coatings, powders and lubricant additives.
Boron Nitride is used across several high-temperature applications and industries, including semiconductor, LED, photovoltaic, vacuum furnaces, atomising, horizontal casting, PVD, plasma systems, sintering and powder metallurgy, lubricant and aluminium casting.
Boron Nitride offers high electrical resistivity, high temperature performance, corrosion resistance, excellent lubricating properties, excellent thermal shock resistance, good chemical inertness, high dielectric strength, high thermal conductivity, low density, non-wetting behaviour and good machinability.
Pyrolytic Boron Nitride, or PBN, is a ceramic made by a chemical vapour deposition process. This gives the material a unique character and makes it suitable for demanding furnace, electrical component, microwave and semiconductor applications.
PBN is used for demanding applications where the very best purity and temperature performance is required, such as MBE. It is also used for industry standard crucibles such as VGF, LEC and Bridgman for Gallium Arsenide crystal production and auxiliary effusion cell hardware.
Hot pressed boron nitride has a hexagonal structure like graphite and is an insulator with properties in temperature, dielectric constant, thermal shock and thermal conductivity. It can also be machined into intricate shapes with no post firing necessary.
Applications include high voltage electrical insulators, heat treatment insulators and fixture, break rings for continuous casting of metals, crucibles for high purity molten metals, high temperature lubricant, high temperature valves, atomising nozzles, refractory applications, PVD insulators and shields, insulating stand offs and vacuum furnace supports.
To discuss Boron Nitride ceramic components, use the Thermic Edge contact page, email sales@thermic-edge.com, or complete the form on this page.
Please contact Thermic Edge with your Boron Nitride ceramic component requirements, including the material type, application, operating temperature, environment, quantity and drawing details where available.
You can also email sales@thermic-edge.com or use the form below.
Thermic Edge offers Boron Nitride, a material used for high temperature applications with excellent thermal conductivity, high electrical resistance, and low thermal expansion. Depending on the required application, they are used as precision components, coatings, powders, and lubricant additives in several different high-temperature applications and numerous industries: Semiconductor, LED, Photovoltaic, Vacuum Furnaces, Atomising, and Horizontal Casting. PVD, Plasma Systems, Sintering and Powder metallurgy, Lubricant and Aluminium Casting.
Thermic Edge does not just offer Boron Nitride and composites but also Mykroy, Alumina Silicate, Macor Alumina, Silicon Nitride, Zirconia, and Aluminium Nitride.
PBN is a ceramic made by a chemical vapour deposition process which gives this material a very unique character. Intrinsically pure, it’s the ideal choice for furnace, electrical components, microwave and Semiconductor applications.
Industry standard crucibles such as VGF, LEC, Bridgman for Gallium Arsenide crystal production and auxiliary effusion cell hardware. PBN/PG Heaters can also be manufactured to provide extremely uniform temperature profiles for both compound and semiconductor manufacturing. With bulk impurities at less than 100 parts per million and metallic impurities less than 10 parts per million, PBN will not react with acids, alkalis, organic solvents, molten metals and graphite’s.
| Crystalline Phase | N/A |
| Binder Phase / Binder Type | CVD Process |
| Colour | Cream |
| Typical Applications | Demanding applications when the very best purity, temperature is required such as MBE |
| Directionality | A & C Direction |
| Mechanical Properties | |
| Flexural Strength | 27,500 PSI |
| Young Modulus | N/A |
| RT Compression | 3700 A Direction 48,000 C Direction Unites PSI |
| Open Porosity | 0 |
| Density | 1.95-2.19 |
| Hardness-Knoop (kg/mm2) | N/A |
| Thermal Properties | |
| Thermal Conductivity @ 25°C W/mK | 0.25 “A” / 0.004 “C” |
| Coefficient of Thermal Expansion (10-62) | |
| 25°C – 400°C | N/A |
| 400°C – 800°C | 0.001 “A” / 0.013 “C” |
| 800°C – 1200°C | N/A |
| 1200°C – 1600°C | 0.0025 “A” / 0.27 “C” |
| Specific Heat @ 25°C J/gK | 0.2 cal/g* deg C |
| Max Temperature Oxidising / Inert | 1900 |
| Electrical Properties | |
| Dieletric Constant @ 1 Mhz | “C” 3.7 |
| Dissipation Factor @ 1 Mhz | n/a |
| Dielectric Strength Kv/mm | “C” 230 |
| RT Resistivity (ohm cm) | 1 x 1015 |
| Dieletric Constant a@ 1 Mhz | “C” 3.7 |
| Dissipation Factor @ 1 Mhz | n/a |
| Dielectric Strength Kv/mm | “C” 230 |
| RT Resistivity (ohm cm) | 1 x 1015 |
BN can be offered in many forms including Powder, Paint, Paste, Aerosol and in Hot pressed solid form.
Hot pressed boron nitride has a hexagonal structure like that of graphite. Although HPBN is an insulator with outstanding properties in Temperature, Dielectric constant, Thermal shock, Thermal conductivity. It can also be easily machined into intricate shapes with no post firing necessary. Hot pressed boron nitride is a powder which is sintered at 2000 deg C plus. Depending on the process there are several grades that can be selected for your requirement. Whether its extreme high temperature high vacuum using no binder due to thermal extraction to moisture resistance using calcium borate glass as a binder. There is a grade of HPBN for most applications.
By changing the Boron Nitride properties adding zirconia for molten metal applications such as break rings for horizontal casting or Silica for unparallel resistance to thermal shock and resistance to moisture and Aluminium nitride for excellent thermal properties it can enhance the properties of Boron Nitride.
