Experts in Substrate Heating

Ceramics and Graphite

Our Technical Ceramics offer high-temperature material solutions for extreme environments. Contact us to find out more about Ceramics and Graphite ranges.

Thermic Edge Machinable Glass Components

MACOR can be joined or sealed to itself and to other materials using epoxy – metallised parts can be soldered, and brazing is used to join various metals to MACOR. Sealing glass produces a reliable tight seal which can be used for high vacuum environments. With a high maximum operating temperature (1000°C under no load, 800°C continuous load) and the flexibility of intricate shaping / precision during manufacture; MACOR offers a higher grade solution to your technical industry’s requirements.

Mykroy shares many properties with MACOR, acting as a highly versatile solution to expensive ceramics, being a more cost-effective option for less heat dependant solutions. High Dielectric Strength Low-Loss Factor Heat Resisting Non-Tracking,  Low Expansion Co-Efficient ,Strong and Rigid; does not creep or deform unlike ductile materials, Low Thermal Conductivity; high temperature insulator, Electrical Insulator, especially at high temperatures, Excellent with high voltages and a broad spectrum of frequencies, Zero Porosity, Radiation Resistant, No outgas in vacuum environments when baked out.

Material

Approximate Weight
Silicon – SiO246%
Magnesium – MgO17%
Aluminium – AL2O316%
Potassium – K2O10%
Boron – B2O37%
Fluorine – F

4%

MYKROY MM500 MACOR
Binder Phase/ Binder type Mica flakes Mica flakes
Colour Light Grey White
Typical Applications Low thermal conductivity and electrical properties. Does not burn or outgas, a cheaper alternative to Macor for high temperature work. Low thermal conductivity, radiation resistance, can also be metallised. A more expensive but versatile material than Mykroy.
Mechanical Properties
Flexural strength 86.2 MPa 94 MPa
Young Modulus (Modulus of Elasticity) 82.7 GPa 66.9 GPa
RT Compression 345 MPa 345 MPa
Open porosity 0% 0%
Density (g/cc mm2) 2.7 2.52
Hardness 90 / 46 Hv 250 Knopp
Thermal Properties
Thermal conductivity @ 25 deg C W/mK 1.15 1.46
Coeff Thermal Expansion (10^-6)
  @ 25°C – 11.57 x 10^-6 @ -100-25°C – 81 x 10^-7
  @ 350°C – 10.53 x 10^-6 @ 25-300°C – 90 x 10^-7
  N/A @ 25-600°C – 112 x 10^-7
  N/A @ 25-800°C – 123 x 10^-7
Specific heat at 25°C  J/gK 0.12 0.79 kJ/kg°C
Max Temp Oxidising / Inert 500°C 800°C – 1000°C
Electrical Properties
Dieletric constant, 25°C 6.9 @ 1MHz 6.01 @ 1KHz 5.64 @ 8.5GHz
Dielectric strength Kv/mm 20.9 45
RT resistivity (ohm.cm), 25°C >10^14 10^17