Experts in Substrate Heating

CVD Systems

A high-performance Chemical Vapor Deposition system designed to apply our unique SiC₃ cubic silicon carbide coatings.

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CVD System Overview

Thermic Edge Ltd proudly introduces the SiC3 CVD Reactor, an advanced Hot Wall Chemical Vapor Deposition system purpose-built to deliver our unique SiC3 cubic silicon carbide coatings on an industrial scale. Developed exclusively by Thermic Edge, SiC3 combines a well-defined crystal structure, isotropic growth, and high-density layering—pushing the boundaries of material protection and purity for critical applications.

Wireframe of SiC3 CVD System

The SiC3 CVD Reactor has been specifically engineered to support high-volume production environments, making it ideally suited for the semiconductor industry, where throughput, repeatability, and contamination control are paramount. Designed with robust thermal uniformity, optimized gas flow dynamics, and precision process control, the reactor ensures consistent, high-purity coatings across large batches of parts with minimal variation.


Whether you're coating complex graphite substrates, porous ceramics, or composite components, the SiC3 reactor enables cost-effective, high-yield manufacturing without compromising on quality or performance. Combined with Thermic Edge's proven expertise in component preparation and post-processing, the system delivers an integrated, scalable solution for next-generation device fabrication and critical process hardware.


With over a decade of continuous operation of our own SiC3 CVD reactor, Thermic Edge brings unparalleled hands-on expertise to the design, optimization, and maintenance of CVD systems. This practical experience has directly informed the development of the SiC3 reactor—ensuring reliability, ease of use, and performance that meet real-world production demands. Our deep process knowledge enables us to support customers beyond installation, offering insights into coating recipes, system tuning, and long-term maintenance strategies.


Key Features

  • Induction or resistive heating options.
  • 316L stainless steel chambers in multiple sizes:
    • 300mm x 450mm with induction heating
    • 1000mm x 1500mm with resistive heating
    • 1500mm x 2000mm with resistive heating
  • High growth rate: 50–60 µm/hour for improved throughput.
  • High purity: < 5 ppm impurities.
  • Precision: +/- 10 µm achievable on 100 µm layers.
  • Dual process chamber capability.
  • Rotational base design to maximise coating uniformity.
  • Maximum temperature: 1700°C (subject to final confirmation).

Product Features

ParameterSpecification
Reactor TypeHot Wall, Vertical CVD Reactor
Process ChambersSingle or Dual Process Chambers (configurable per production requirements)
Heating MethodResistive Heating or Induction Heating options available depending on application and power limitations at site of installation
Chamber Wall Material316L Stainless Steel
Coating MaterialCubic Silicon Carbide (β-SiC)
Deposition ProcessLPCVD or Atmospheric CVD (customizable)
Typical Coating Thickness80–100 µm (variable up to 200 µm upon request)
Thickness Uniformity±10 µm on 100 µm layer (targeting ±5 µm in development)
Growth Rate50–60 µm per hour
Surface RoughnessAdjustable (Ra tailored to application requirements)
Coating PurityUltra-high purity; low nitrogen absorption; nitrogen-free option available
Substrate TypesGraphite, Porous Ceramics, Composites
Geometry CapabilityHigh conformity on complex 3D shapes and blind holes (Ø1mm × 5mm)
Chamber Size (Processing Zone)Ø300 mm × 450 mm height, Ø1000mm x 1500mm, Ø1500mm x 2000mm
Rotational BaseIncluded for maximised uniformity of deposition
Loading MechanismMotorised chamber lift system for vertical loading
Max Substrate TemperatureUp to 1400 °C (depending on process and materials)
Process GasesSiCl₄, CH₄, H₂, Ar (with high-purity MFC-controlled delivery and mixing via Coriolis before distribution to reactor)
Carrier Gas ControlMulti-zone gas injection with precision MFC regulation
Automation & InterfacePLC-based control; optional SECS/GEM automation interface
Process Repeatability<2% variation across batch under standardised conditions
System FootprintModular; optimized for cleanroom integration and scalability

Material High Purity

This table shows the impurities of SiC³ coating.
Lowest limit of detection with this method. Testing carried out by EAG Laboratories using Glow Discharge Mass Spectroscopy.

XRD Diagram of SiC3 Coating

SIC Specifications

PropertyValue
Density3200 kg/m3
Crystal Structure3C (cubic; β)
Porosity0% (helium leak tight)
Crystal Size1 – 5 μm
AppearanceGrey, satin to dull
Thermal Expansion (RT–400°C)4.2 x 10-6 m/K
Thermal Conductivity (@ 20°C)200 W/m·K
Elastic Modulus450 GPa
Electrical Resistivity (@ 20°C)1 MΩ·m

Impurity Levels Comparison (Measured with GDMS; 5 μm deep into SiC coating)

ElementTECC1C2
Sodium< 0.010.310.34
Magnesium< 0.010.060.13
Aluminium< 0.023.21.1
Potassium< 0.5< 0.5< 0.5
Calcium< 0.050.620.62
Titanium< 0.0050.250.14
Vanadium< 0.005< 0.005< 0.005
Chromium< 0.30.96< 0.3
Iron< 0.044.10.55
Cobalt< 0.05< 0.05< 0.05
Nickel< 0.051.1< 0.05
Molybdenum< 0.050.08< 0.05
Tin< 0.05< 0.05< 0.05
Tungsten< 0.010.691.1

Measured with GDMS; 5 μm deep into SiC coating

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CVD System Overview

Thermic Edge Ltd proudly introduces the SiC3 CVD Reactor, an advanced Chemical Vapor Deposition system purpose-built to deliver our unique SiC3 cubic silicon carbide coatings. Developed exclusively by Thermic Edge, SiC3 combines a well-defined crystal structure, isotropic growth, and high-density layering—pushing the boundaries of material protection and purity for critical applications.

CVD System

Key Features

  • Induction heating or Resistive heating options.
  • Various sized diameter chambers available made from 316L Stainless Steel:
    • 300mm x 450mm with induction heating
    • 1000mm x 1500mm with resistive heating.
    • 1500 x 2000mm with resistive heating.
  • High growth rate 50-60µm/Hr for faster throughput and lower cost per part.
  • High Purity <5ppm impurities.
  • +/- 10µm achievable on a 100µm layers.
  • Dual process chamber capability.
  • Rotational base design to maximise uniformity.
  • Max temperature: 1700℃

Product Features

ParameterSpecification
Reactor TypeHot Wall, Vertical CVD Reactor
Process ChambersSingle or Dual Process Chambers (configurable per production requirements)
Heating MethodResistive Heating or Induction Heating options available depending on application and power limitations at site of installation
Chamber Wall Material316L Stainless Steel
Coating MaterialCubic Silicon Carbide (β-SiC)
Deposition ProcessLPCVD or Atmospheric CVD (customizable)
Typical Coating Thickness80–100 µm (variable up to 200 µm upon request)
Thickness Uniformity±10 µm on 100 µm layer (targeting ±5 µm in development)
Growth Rate50–60 µm per hour
Surface RoughnessAdjustable (Ra tailored to application requirements)
Coating PurityUltra-high purity; low nitrogen absorption; nitrogen-free option available
Substrate TypesGraphite, Porous Ceramics, Composites
Geometry CapabilityHigh conformity on complex 3D shapes and blind holes (Ø1mm × 5mm)
Chamber Size (Processing Zone)Ø300 mm × 450 mm height, Ø1000mm x 1500mm, Ø1500mm x 2000mm
Rotational BaseIncluded for maximised uniformity of deposition
Loading MechanismMotorised chamber lift system for vertical loading
Max Substrate TemperatureUp to 1400 °C (depending on process and materials)
Process GasesSiCl₄, CH₄, H₂, Ar (with high-purity MFC-controlled delivery and mixing via Coriolis before distribution to reactor)
Carrier Gas ControlMulti-zone gas injection with precision MFC regulation
Automation & InterfacePLC-based control; optional SECS/GEM automation interface
Process Repeatability<2% variation across batch under standardised conditions
System FootprintModular; optimized for cleanroom integration and scalability

Material High Purity

This table shows the impurities of SiC³ coating.
Lowest limit of detection with this method. Testing carried out by EAG Laboratories using Glow Discharge Mass Spectroscopy.

XRD Diagram of SiC3 Coating
CVD Systems
Chemical Vapour Deposition
CVD

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Technical Specifications

PropertyValue
Density3200 kg/m3
Crystal Structure3C (cubic; β)
Porosity0% (helium leak tight)
Crystal Size1 – 5 μm
AppearanceGrey, satin to dull
Thermal Expansion (RT–400°C)4.2 x 10-6 m/K
Thermal Conductivity (@ 20°C)200 W/m·K
Elastic Modulus450 GPa
Electrical Resistivity (@ 20°C)1 MΩ·m

Impurity Levels Comparison (Measured with GDMS; 5 μm deep into SiC coating)

ElementTECC1C2
Sodium< 0.010.310.34
Magnesium< 0.010.060.13
Aluminium< 0.023.21.1
Potassium< 0.5< 0.5< 0.5
Calcium< 0.050.620.62
Titanium< 0.0050.250.14
Vanadium< 0.005< 0.005< 0.005
Chromium< 0.30.96< 0.3
Iron< 0.044.10.55
Cobalt< 0.05< 0.05< 0.05
Nickel< 0.051.1< 0.05
Molybdenum< 0.050.08< 0.05
Tin< 0.05< 0.05< 0.05
Tungsten< 0.010.691.1

Measured with GDMS; 5 μm deep into SiC coating

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If you have selected 'Exhibition or Event', please add where it was held in the message box below.

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