• Boron Nitride Overview
  • Pure Boron Nitride
  • Composite Boron Nitrides
  • PBN - Pyrolytic Boron Nitride
  • Macor & Mykroy
  • AlN - High Grade Aluminium Nitride

Ceramics are an important part of our service to you. Quality is our priority, that’s why we only source high grade Boron Nitride for our standard range.

Boron Nitride Overview

Boron Nitride Ceramics can be offered in many forms including: Powder, Paint, Paste, Aerosol and in Hot pressed solid form along with Pyrolytic Boron Nitride (PBN), a Chemical vapour deposition material.

PBN PBN 1

With its intrinsic purity, Pyrolytic Boron Nitride is an excellent choice for microwave and Semiconductor components, standard crucibles for MBE, and Gallium Arsenide crystal production.

PBN Properties PBN Applications
High electrical resistivity High voltage electrical insulators
High temperature material Heat treatment insulators and fixture
Corrosion resistant Break rings for continuous casting of metals
Excellent lubricating properties Crucibles for high purity molten metals
Excellent thermal shock resistance High temperature lubricant
Good chemical inertness High temperature valves
High dielectric strength Atomising Nozzles
High thermal conductivity Refractory applications
Low density PVD insulators and shields
Non-wetting Insulating Stand offs
Good machinability Vacuum furnace supports

 

Below you will find a sample of data reflecting the traits of our high quality Boron Nitride so you can find the best fit for your application.

Pure Boron Nitrides

  BN50 BN100 BN150 BN300
Crystalline Phase Hexagonal BN Hexagonal BN Hexagonal BN 99% Hexagonal BN >99%
Binder Phase / Binder Type Boric Oxide Calcium Borate Boric Oxide Self Bonded
Colour White White White White
Typical Applications General Purpose Outstanding moisture resistance, Refractory, Dielectric strength High temperature and purity. Dielectric strength, Low expansion, high thermal conductivity Extreme corrosion resistance, high purity temperature, thermal conductivity
Directionality

 

Parallel / Perpendicular Parallel / Perpendicular Parallel / Perpendicular Parallel / Perpendicular
Flexural Strength 94 / 65 59 / 45 14 / 30 22 / 21
Young Modulus 47 / 74 40 / 60 n/a 17 / 71
RT Compression 143 / 186 96 n/a 25
Open Porosity 2.84 N/A 15 19.3
Density 2 2 1.9 1.9
Hardness – Knoop (KG/mm2) 20 16 5 4
Thermal Conductivity @25°C W/mK 30 / 34 27 / 29 21 78 / 130
Coefficient of Thermal Expansion (10-62)
25°C – 400°C 3 / 3 0.6 / 0.4 n/a -2.3 / -0.7
400°C – 800°C 2 / 1.4 1.1 / 0.8 n/a -2.5 / 1.1
800°C – 1200°C 1.9 / 1.8 1.5 / 0.9 5.5 / 1 1.6 / 0.4
1200°C – 1600°C 5 / 4.8 2.8 / 2.7 n/a 0.9 / 0.3
1600°C – 1900°C 7.2 / 6.1 n/a n/a 0.5 / 0.9
Specific Heat at 25°C J/gK 8.60E-01 8.10E-01 n/a 0.81
Max Temp Oxidising / Inert 850 / 1200 C 850 / 1150 C 850 / 1900 850 / 2000 C

Boron Nitride is the perfect versatile ceramic for strenuous temperature conditions and corrosive environments.

Composite Boron Nitrides

  BNS26 BNM ZBN100 ABN100
Crystalline Phase BN-60% SiO2-40 BN-40% SiO2-60% BN-45% ZrO2-45% BN-72% Aln-25%
Binder Phase / Binder Type SiO2 SiO2 Borosilicate n/a
Colour White White Grey Grey
Typical Applications Extreme thermal conductivity, Moisture resistance, Dielectric strength Extreme thermal conductivity, Moisture resistance, Dielectric strength Extreme wear and corrosion resistance in molten metal applications Extreme high thermal conductivity and flexural strength comparable with Alumina
Directionality Parallel / Perpendicular Parallel / Perpendicular Parallel / Perpendicular Parallel / Perpendicular
Flexural Strength 62 / 34 103 / 76 144 / 107 94 / 65
Young Modulus N/A 94 / 106 71 / 71 47 / 74
RT Compression N/A 317 / 289 218 / 253 143 / 186
Open Porosity 6.7 6.88 1.066 2.84
Density 2.1 2.3 2.9 2
Hardness – Knoop (KG/mm2) N/A N/A 100 20
Thermal Conductivity @25°C W/mK Nov-29 Dec-14 24 / 34 92.6
Coefficient of Thermal Expansion (10-62)
25°C – 400°C 3.0 / 0.4 1.5 / 0.2 4.1 / 3.4 n/a
400°C – 800°C 2.5 / 0.1 1.2 / 0.4 5.6 / 4.3 n/a
800°C – 1200°C 3.0 / 0.1 1.2 / 0.4 7.2 / 5.2 n/a
1200°C – 1600°C n/a n/a 4.6 / 3.4 0.57 / 0.46
1600°C – 1900°C n/a n/a n/a n/a
Specific Heat at 25°C J/gK 0.77 0.76 0.64 1.5
Max Temp Oxidising / Inert 1000 C + 1000 C + 850 / 1600 C 1020 / 1900
PBN_Baseplate PBN_Lower_bush PBN_Lower_Heatshield

PBN - Pyrolytic Boron Nitride

PBN is a ceramic made by a chemical vapour deposition process which gives this material a very unique character. Intrinsically pure, it’s the ideal choice for furnace, electrical components, microwave and Semiconductor applications.

Industry standard crucibles such as VGF, LEC, Bridgman for Gallium Arsenide crystal production and auxiliary effusion cell hardware. PBN/PG Heaters can also be manufactured to provide extremely uniform temperature profiles for both compound and semiconductor manufacturing. With bulk impurities at less than 100 parts per million and metallic impurities less than 10 parts per million, PBN will not react with acids, alkalis, organic solvents, molten metals and graphite’s.

Crystalline Phase N/A
Binder Phase / Binder Type CVD Process
Colour Cream
Typical Applications Demanding applications when the very best purity, temperature is required such as MBE
Directionality A & C Direction
Mechanical Properties
Flexural Strength 27,500 PSI
Young Modulus N/A
RT Compression 3700 A Direction 48,000 C Direction Unites PSI
Open Porosity 0
Density 1.95-2.19
Hardness-Knoop (kg/mm2) N/A
Thermal Properties
Thermal Conductivity @ 25°C W/mK 0.25 “A” / 0.004 “C”
Coefficient of Thermal Expansion (10-62)
25°C – 400°C N/A
400°C – 800°C 0.001 “A” / 0.013 “C”
800°C – 1200°C N/A
1200°C – 1600°C 0.0025 “A” / 0.27 “C”
Specific Heat @ 25°C J/gK 0.2 cal/g* deg C
Max Temperature Oxidising / Inert 1900
Electrical Properties
Dieletric Constant @ 1 Mhz “C” 3.7
Dissipation Factor @ 1 Mhz n/a
Dielectric Strength Kv/mm “C” 230
RT Resistivity (ohm cm) 1 x 1015
Dieletric Constant a@ 1 Mhz “C” 3.7
Dissipation Factor @ 1 Mhz n/a
Dielectric Strength Kv/mm “C” 230
RT Resistivity (ohm cm) 1 x 1015
pbn_boat pbn_crucible
pbn-cvd pbn_crucible 2

Included in our exclusive range of high grade materials, we also offer Macor & Mykroy Machinable Glass Ceramics. Highly efficient and versatile – these materials provide an outstanding combination of mechanical, thermal, electrical and chemical properties.

Machinable Glass

MACOR can be joined or sealed to itself and to other materials using epoxy – metallised parts can be soldered and brazing is used to join various metals to MACOR. Sealing glass produces a reliable tight seal which can be used for high vacuum environments. With a high maximum operating temperature  (1000°C under no load, 800°C continuous load) and the flexibility of intricate shaping / precision during manufacture; MACOR offers a higher grade solution to your technical industry’s requirements.

MYKROY shares many properties with MACOR, acting as a highly versatile solution to expensive ceramics, being a more cost effective option for less heat dependant solutions.

  • High Dielectric Strength
  • Low-Loss Factor
  • Heat Resisting
  • Non-Tracking
  • Low Expansion Co-Efficient
  • Strong and Rigid; does not creep or deform unlike ductile materials
  • Low Thermal Conductivity; high temperature insulator
  • Electrical Insulator, especially at high temperatures
  • Excellent with high voltages and a broad spectrum of frequencies
  • Zero Porosity
  • Radiation Resistant
  • No outgas in vacuum environments when baked out

MACOR has uses in ultra-high vacuum environments to insulate or support coils for vacuum feed-troughs. Supporting conductive materials and using a compatible sealing glass, these machinable glass ceramics can be used to produce a vacuum-tight hermetic seal.

Various industries find uses for Machinable Glass Ceramics, such as:

  • Semiconductor – thermal insulation, wafer production vacuum chuck components.
  • Aerospace Engineering – mechanical joints, hermetic seals.
  • Nuclear experiments and Chemical Processing – dimensionally unaffected by irradiation.
  • Heathcare equipment components – RF insulation for electrical scalpel, thermal barrier for syringe production.
  • Rail Transportation and Power Generation – high voltage insulation.
  • Analytical Instrumentation – mass spectrometer filament bases.
MYKROY MM500 MACOR
Binder Phase/ Binder type Mica flakes Mica flakes
Colour Light Grey White
Typical Applications Low thermal conductivity and electrical properties. Does not burn or outgas, a cheaper alternative to Macor for high temperature work. Low thermal conductivity, radiation resistance, can also be metallised. A more expensive but versatile material than Mykroy.
Mechanical Properties
Flexural strength 86.2 MPa 94 MPa
Young Modulus (Modulus of Elasticity) 82.7 GPa 66.9 GPa
RT Compression 345 MPa 345 MPa
Open porosity 0% 0%
Density (g/cc mm2) 2.7 2.52
Hardness 90 / 46 Hv 250 Knopp
Thermal Properties
Thermal conductivity @ 25 deg C W/mK 1.15 1.46
Coeff Thermal Expansion (10^-6)
  @ 25°C – 11.57 x 10^-6 @ -100-25°C – 81 x 10^-7
  @ 350°C – 10.53 x 10^-6 @ 25-300°C – 90 x 10^-7
  N/A @ 25-600°C – 112 x 10^-7
  N/A @ 25-800°C – 123 x 10^-7
Specific heat at 25°C  J/gK 0.12 0.79 kJ/kg°C
Max Temp Oxidising / Inert 500°C 800°C – 1000°C
Electrical Properties
Dieletric constant, 25°C 6.9 @ 1MHz 6.01 @ 1KHz

5.64 @ 8.5GHz

Dielectric strength Kv/mm 20.9 45
RT resistivity (ohm.cm), 25°C >10^14 10^17

Macor Composition

Material

Approximate Weight
Silicon – SiO2 46%
Magnesium – MgO 17%
Aluminium – AL2O3 16%
Potassium – K2O 10%
Boron – B2O3 7%
Fluorine – F

4%

(AlN) Aluminium Nitride combines high thermal conductivity with high mechanical strength, providing a broad range of uses as a structural material.

AlN - Aluminium Nitride

Ceramics possess unique properties that other materials and metals lack – the processing of ceramics involves a large amount of effort due the hard and brittle nature of their composition.

If high thermal conductivity is required then look no further – AlN is ideal as a heat sink material for various electrical applications.

Below is a list of the various applications of this material:

  • Power semiconductor devices – ideal substrate for active metal braze, power transistors, transformers with high capacity and metallisation.
  • Opto-electronics – high power and high frequency microelectronic packages.
  • RF/Microwave components – thermal management requirements
    • Cable TV, Digital Amps etc.
Shapal M Lite ABN100
Crystalline phase BN-75% Aln- 25% BN-72% Aln-23% Yttria-5%
Binder Phase/ Binder type N/A N/A
Colour Cream Grey
Typical Applications Extreme high thermal conductivity and flexural strength comparable with Alumina Extreme high thermal conductivity and flexural strength comparable with Alumina
Mechanical Properties
Flexural strength 300 MPa 300 MPa
Young Modulus 1.8 x 10+4 34.1 / 75.20
RT Compression 100 kg/mm 1070
Open porosity 0 0
Density (g/cc mm2) 2.88 2.9
Hardness- Knoop (KG/mm2) 380 342
Thermal Properties
Thermal conductivity @ 25°C W/mK 0.25 “A” / 0.004 “C” 92
Coeff Thermal Expansion (10-6)
25 – 400 C n/a 4.8 x 10+6
400 – 800 C 0.001 “A” / 0.013 “C” 5 x 10+6
800 – 1200 C n/a n/a
1200  – 1600 C 0.0025 “A” / 0.27 “C” n/a
1600  – 1900 C n/a n/a
Specific heat at 25°C  J/gK 0.2 cal/g* deg C n/a
Max Temp  oxidising / Inert 1900 1000 / 1900
Electrical Properties
Dieletric constant a@ 1 Mhz “C” 3.7 6.8
Dissipation factor @ 1 Mhz n/a 10 x 10+4
Dielectric strength Kv/mm “C” 230 65
RT resistivity (ohm cm) 1 x 1015 3.2 x 101

 

Grade BN – AIN (ALBN)
Compositions BN+AIN
Density (g/cm^3) 2.80-2.90
25°C Electrical Resistivity (ohm.cm) >10^13
Max Service Temp. (°C)

·        Oxygen

·        Inert Gas

·        Longstanding in High Vacuum

 

1000

1800

1800

Three-point Flexural Strength (Mpa) 90
Compressive Strength(Mpa) 220
Coefficient of Thermal Expansion 25°C~1000°C (10-6/k) 2.8
Thermal Conductivity (W/mK) 85
Typical Applications Powder Metallurgy
Insulators for High Temperature Furnaces Yes
Metal Evaporation Crucible No
Parts for Melting Metals or Glasses Yes
Mould Accessories for Melting of Precious Metals and Special Alloys No
High Temperature High-loaded Supporting Components Yes
Transfer Tube and Nozzle for Melting Metals Yes

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